Thermally assisted magnetic head

ABSTRACT

A thermally assisted magnetic head has a slider having a medium-facing surface, and a light source unit having a light source support substrate, and a light source disposed on the light source support substrate. The slider has a slider substrate and a magnetic head portion disposed on a side of the medium-facing surface in the slider substrate; the magnetic head portion includes a magnetic recording element for generating a magnetic field, and a waveguide for receiving light through an end face opposite to the medium-facing surface, and guiding the light to the medium-facing surface; the light source support substrate is fixed to a surface opposite to the medium-facing surface in the slider substrate so that light emitted from the light source can enter the end face of the waveguide.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a thermally assisted magnetic head forwriting of signals by thermally assisted magnetic recording and to ahead gimbal assembly (HGA) with this thermally assisted magnetic head,and a hard disk drive with this HGA.

2. Related Background of the Invention

As the recording density of the hard disk drive increases, furtherimprovement is demanded in the performance of the thin film magnetichead. The thin film magnetic head commonly used is a composite type thinfilm magnetic head of a structure in which a magnetic detecting elementsuch as a magneto-resistive (MR) effect element and a magnetic recordingelement such as an electromagnetic coil element are stacked, and theseelements are used to read and write data signals from and into amagnetic disk as a magnetic recording medium.

In general, the magnetic recording medium is a kind of a discontinuousbody of fine magnetic particles aggregated, and each of the finemagnetic particles is made in a single magnetic domain structure. Arecording bit is composed of a plurality of fine magnetic particles.Therefore, in order to increase the recording density, it is necessaryto decrease the size of the fine magnetic particles and thereby decreaseunevenness at borders of recording bits. However, the decrease in thesize of the fine magnetic particles raises the problem of degradation ofthermostability of magnetization due to decrease of volume.

A measure of the thermostability of magnetization is given byK_(U)V/k_(B)T. In this case, K_(U) represents the magnetic anisotropyenergy of the fine magnetic particles, V the volume of one magneticparticle, k_(B) the Boltzmann constant, and T absolute temperature. Thedecrease in the size of fine magnetic particles is nothing but decreasein V, and, without any countermeasures, the decrease in V will lead todecrease of K_(U)V/k_(B)T and degradation of the thermostability. Aconceivable countermeasure to this problem is to increase K_(U) at thesame time, but this increase of K_(U) will lead to increase in thecoercive force of the recording medium. In contrast to it, the intensityof the writing magnetic field by the magnetic head is virtuallydetermined by the saturation magnetic flux density of a soft magneticmaterial making the magnetic poles in the head. Therefore, the writingbecomes infeasible if the coercive force exceeds a tolerance determinedfrom this limit of writing magnetic field intensity.

As a method of solving this problem of thermostability of magnetizationthere is the following proposal of so-called thermally assisted magneticrecording: while a magnetic material with large K_(U) is used, heat isapplied to the recording medium immediately before application of thewriting magnetic field, to decrease the coercive force, and writing isperformed in that state. This recording is generally classified undermagnetic dominant recording and optical dominant recording. In themagnetic dominant recording, the dominant of writing is anelectromagnetic coil element and the radiation diameter of light islarger than the track width (recording width). On the other hand, in theoptical dominant recording, the dominant of writing is a light radiatingportion and the radiation diameter of light is approximately equal tothe track width (recording width). Namely, the magnetic field determinesthe spatial resolution in the magnetic dominant recording, whereas thelight determines the spatial resolution in the optical dominantrecording.

Patent Documents (International Publication WO92/02931 (JP-A 6-500194),International Publication WO98/09284 (JP-A 2002-511176), Japanese PatentApplication Laid-Open No. 10-162444, International PublicationWO99/53482 (JP-A 2002-512725), Japanese Patent Application Laid-Open No.2000-173093, Japanese Patent Application Laid-Open No. 2002-298302,Japanese Patent Application Laid-Open No. 2001-255254) and Non-patentDocument (Shintaro Miyanishi et al., “Near-field Assisted MagneticRecording” IEEE TRANSACTIONS ON MAGNETICS, 2005, Vol. 41, No. 10, pp2817-2821) disclose the thermally assisted magnetic head recordingapparatus of this type, in the structure in which a light source such asa semiconductor laser is located at a position apart from a slider witha magnetic recording element for generating a magnetic field and inwhich light from this light source is guided through an optical fiber, alens, etc. to a medium-facing surface of the slider.

Furthermore, Patent Documents (Japanese Patent Application Laid-Open No.2001-283404, Japanese Patent Application Laid-Open No. 2001-325756,Japanese Patent Application Laid-Open No. 2004-158067, Japanese PatentApplication Laid-Open No. 2004-303299) and Non-patent Document (KeijiShono and Mitsumasa Oshiki “Status and Problems of Thermally AssistedMagnetic Recording” Journal of the Magnetics Society of Japan, 2005,Vol. 29, No. 1, pp 5-13) disclose the thermally assisted magnetic headin which the magnetic recording element and the light source areintegrated on a side surface of the slider, and the thermally assistedmagnetic head in which the magnetic recording element and the lightsource are integrated on the medium-facing surface of the slider.

SUMMARY OF THE INVENTION

However, when the light source is located at the place far from theslider, the optical fiber, lens, mirror, etc. have to be used over along distance for guiding light, which poses a problem of largereduction in propagation efficiency of light and a problem ofcomplicated structure of the entire apparatus.

When the light source, in addition to the magnetic recording element, isintegrated on the side surface of the slider, the yield of the thermallyassisted magnetic head is likely to largely decrease by virtue ofsynergetic effect of the yield of the magnetic recording element and theyield of the light source.

For example, in the case of a laser diode (semiconductor laser) chip asan example of the light source, such characteristics as the output, thespread angle of laser light, and the life largely vary according tostress on the chip. It is thus necessary to perform characteristic testsof the chip after the chip is mounted on a substrate or the like. As aresult, the yield of the magnetic head portion and the yield of thelaser diode part both cumulatively affect the production yield of theentire head, so as to heavily degrade the yield of the entire head.

Furthermore, when the magnetic recording element and the light sourceare integrated on the medium-facing surface of the slider, the yieldproblem similar to that described above also arises and, because in thismethod the magnetic recording element and the magnetic detecting elementare formed on the medium-facing surface different from the side surfaceof the slider on which the magnetic recording element and the magneticdetecting element used to be formed, it is difficult to apply theproduction methods of the conventional magnetic detecting elements, forexample, such as the perpendicular conduction giant magneto-resistive(CPP (Current Perpendicular to Plane)-GMR) effect element and themagnetic recording element with the electromagnetic coil forperpendicular magnetic recording, and it is thus very difficult toproduce the thermally assisted magnetic head with sufficientperformance.

An object of the present invention is therefore to provide a thermallyassisted magnetic head that can be produced at an increased yield, thatcan be produced by applying the production methods of the conventionalmagnetic recording elements, and that can be constructed in a simplestructure, an HGA with this thermally assisted magnetic head, and a harddisk drive with this HGA.

Before explaining the present invention, the terms to be used in thespecification are defined as follows. In a multilayer structure of amagnetic head portion formed on an integration surface of a slider, aconstituent element on the slider side with respect to a reference layerwill be defined as an element located “under” or “below” the referencelayer, and a constituent element on the stack side with respect to thereference layer will be defined as an element located “over” or “above”the reference layer.

A thermally assisted magnetic head according to the present invention isa thermally assisted magnetic head comprising: a slider having amedium-facing surface; and a light source unit having a light sourcesupport substrate and a light source disposed on the light sourcesupport substrate; wherein the slider has a slider substrate and amagnetic head portion disposed on a side of the medium-facing surface inthe slider substrate; wherein the magnetic head portion comprises amagnetic recording element for generating a magnetic field, and awaveguide for receiving light through an end face thereof opposite tothe medium-facing surface, and guiding the light to the medium-facingsurface; wherein the light source support substrate is fixed to asurface opposite to the medium-facing surface in the slider substrate sothat light emitted from the light source can enter the end face of thewaveguide.

According to the present invention, the magnetic head portion is fixedto the slider substrate and the light source is fixed to the lightsource support substrate; therefore, the thermally assisted magnetichead as a nondefective device can be produced with a good yield by firstindependently testing the magnetic recording element fixed to the slidersubstrate and the light source fixed to the light source supportsubstrate and thereafter fixing the slider as a nondefective unit andthe light source unit as a nondefective unit to each other. Since themagnetic head portion is disposed on the side surface of the slidersubstrate, the magnetic recording element of the magnetic head portioncan be readily produced by applying the conventional thin-film magnetichead production methods. Since the light source is located at theposition apart from the medium-facing surface and near the slider, it isfeasible to suppress adverse effect of heat generated from the lightsource, on the magnetic recording element and others, and possibilitiesof contact or the like between the light source and the medium, toreduce propagation loss of light because of dispensability of an opticalfiber, a lens, a mirror, etc., and to simplify the structure.

Preferably, the light source is disposed on a side surface of the lightsource support substrate, which facilitates fixing of the light sourceto the light source support substrate.

The light source is preferably a laser diode.

Preferably, λs≦λl is satisfied, where λs is a thermal conductivity ofthe slider substrate and λl is a thermal conductivity of the lightsource support substrate.

Preferably, a heat insulation layer is disposed on an opposed surface tothe light source support substrate in the slider substrate or on anopposed surface to the slider substrate in the light source supportsubstrate.

These permit the heat generated by the light source to be guided throughthe light source support substrate to the outside, while minimizingtransfer of the heat to the slider substrate.

Preferably, the slider substrate and the light source support substrateare fixed to each other with a UV cure type adhesive, whereby they canbe readily and highly accurately fixed to each other without applicationof heat, by applying UV after alignment thereof.

Preferably, in the magnetic head portion the waveguide is locatedbetween the magnetic recording element and the slider substrate.

Since the recording medium normally moves in the direction from theslider substrate toward the head portion with respect to themedium-facing surface, the above configuration provides an effect offirst heating the medium by action of light entering the waveguide andthereafter applying the magnetic field generated from the magneticrecording element, to the heated region.

Preferably, the magnetic head portion further comprises a magneticdetecting element, and the waveguide is located between the magneticrecording element and the magnetic detecting element.

This decreases a time from the heating of the medium to the applicationof the recording magnetic field, and permits the recording magneticfield to be applied to the medium before significant decrease in thetemperature of the medium. As a result, the heating temperature can belowered, and it provides an effect of reducing power consumption of thelaser diode in the heating of the medium.

Preferably, the thermally assisted magnetic head further comprises anear-field light generator for generating near-field light, on an endface on the medium-facing surface side of the waveguide, whereby thenear-field light can be readily generated.

The near-field light generator is, for example, an electricallyconductive sheet of a triangular shape or the like when viewed from themedium-facing surface.

A head gimbal assembly according to the present invention is a headgimbal assembly comprising any one of the above-described thermallyassisted magnetic heads, and a suspension supporting the thermallyassisted magnetic head.

A hard disk drive according to the present invention comprises theabove-described head gimbal assembly, and a magnetic recording medium.

Since the present invention improves the yield and permits applicationof the production methods of the conventional magnetic recordingelements and simplification of the structure, high-density recording canbe readily implemented by the thermally assisted magnetic recording.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view schematically showing a configuration of amajor part in an embodiment of a hard disk drive and HGA according tothe present invention.

FIG. 2 is an enlarged perspective view of a part near a distal end ofthe HGA in FIG. 1.

FIG. 3 is a perspective view schematically showing a configuration of athermally assisted magnetic head in FIG. 1.

FIG. 4 is a sectional view perpendicular to a medium-facing surface ofthe thermally assisted magnetic head in FIG. 3.

FIG. 5 is a schematic view from the medium-facing surface of thethermally assisted magnetic head in FIG. 4.

FIG. 6 is a perspective view showing a waveguide and a near-field lightgenerator in the thermally assisted magnetic head in FIG. 3.

FIG. 7 is a schematic perspective view showing a configuration of alaser diode.

FIG. 8 is perspective views showing a production method of the waveguideand near-field light generator in order of (A)-(D).

FIG. 9 is perspective views, subsequent to FIG. 8, showing theproduction method of the waveguide and near-field light generator inorder of (A)-(C).

FIG. 10 is perspective views showing a production method of thethermally assisted magnetic head in order of (A) and (B).

DESCRIPTION OF THE PREFERRED EMBODIMENTS

Embodiments for carrying out the present invention will be describedbelow in detail with reference to the accompanying drawings. In each ofthe drawings, the same elements will be denoted by the same referencenumerals. It is also noted that the dimensional ratios in and betweenthe constituent elements in the drawings are arbitrary, for easierunderstanding of the drawings.

FIG. 1 is a perspective view schematically showing a configuration of amajor part in an embodiment of the hard disk drive and HGA (head gimbalassembly) according to the present invention. FIG. 2 is an enlargedperspective view of a part near a thermally assisted magnetic head 21 inFIG. 1. In the perspective view of the HGA, the side of the HGA facing asurface of a magnetic disk is illustrated up.

(Hard Disk Drive)

In (A) of FIG. 1, the hard disk drive 1 has magnetic disks 10 consistingof a plurality of magnetic recording media to rotate around a rotationshaft of spindle motor 11, an assembly carriage device 12 forpositioning each thermally assisted magnetic head 21 on a track, and arecording, reproduction, and emission control circuit (control circuit)13 for controlling writing and reading operations of each thermallyassisted magnetic head 21 and for controlling a laser diode as a lightsource for emitting laser light for thermally assisted magneticrecording, which will be detailed later.

The assembly carriage device 12 is provided with a plurality of drivearms 14. These drive arms 14 are angularly rockable around a pivotbearing shaft 16 by voice coil motor (VCM) 15, and are stacked in thedirection along this shaft 16. An HGA 17 is attached to the distal endof each drive arm 14. Each HGA 17 is provided with a thermally assistedmagnetic head 21 so that it faces the surface of each magnetic disk 10.The surface of the magnetic head 21 facing the surface of the magneticdisk 10 is a medium-facing surface S (which is also called an airbearing surface) of the thermally assisted magnetic head 21. The numberof each of magnetic disks 10, drive arms 14, HGAs 17, and thermallyassisted magnetic heads 21 may be one.

(HGA)

The HGA 17 is constructed, as shown in (B) of FIG. 1, by fixing thethermally assisted magnetic head 21 to a distal end of suspension 20 andelectrically connecting one end of wiring member 203 to terminalelectrodes of the thermally assisted magnetic head 21. The suspension 20is composed mainly of a load beam 200, a flexure 201 with elasticityfixed and supported on this load beam 200, a tongue portion 204 formedin a plate spring shape at the tip of the flexure, a base plate 202disposed on the base part of the load beam 200, and a wiring member 203disposed on the flexure 201 and consisting of a lead conductor andconnection pads electrically connected to the both ends of the leadconductor.

The wiring member, as shown in FIG. 2, has a pair of electrode pads 237,237 for recording signal, a pair of electrode pads 238, 238 for readoutsignal, and a pair of electrode pads 247, 248 for driving of the lightsource.

It is obvious that the structure of the suspension in the HGA 17 of thepresent invention is not limited to the above-described structure. An ICchip for driving of the head may be mounted midway in the suspension 20,though not shown.

(Thermally Assisted Magnetic Head)

As shown in FIGS. 2 to 4, the thermally assisted magnetic head 21 has aconfiguration in which a slider 22, and a light source unit 23 having alight source support substrate 230 and a laser diode 40 as a lightsource for thermally assisted magnetic recording are bonded and fixed toeach other so that a back surface 2201 of a slider substrate 220 is incontact with a bond surface 2300 of the light source support substrate230. The back surface 2201 of the slider substrate 220 herein is asurface opposite to the medium-facing surface S of the slider 22. Abottom surface 2301 of the light source support substrate 230 is bondedto the tongue portion 204 of the flexure 201, for example, with anadhesive such as epoxy resin.

(Slider)

The slider 22 has a slider substrate 220, and a magnetic head portion 32for performing writing and reading of data signal.

The slider substrate 220 is of a plate shape and has the medium-facingsurface S processed so as to achieve an appropriate levitation amount.The slider substrate 220 is made of electrically conductive AlTiC(Al₂O₃−TiC) or the like.

The magnetic head portion 32 is formed on an integration surface 2202which is a side surface approximately perpendicular to the medium-facingsurface S of the slider substrate 220. The magnetic head portion 32 hasan MR effect element 33 as a magnetic detecting element for detectingmagnetic information, an electromagnetic coil element 34 as aperpendicular (or, possibly, longitudinal) magnetic recording elementfor writing magnetic information by generation of a magnetic field, awaveguide 35 as a planar waveguide provided through between the MReffect element 33 and the electromagnetic coil element 34, a near-fieldlight generator 36 for generating near-field light for heating arecording layer portion of a magnetic disk, an insulating layer 38formed on the integration surface 2202 so as to cover these MR effectelement 33, electromagnetic coil element 34, waveguide 35, andnear-field light generator 36, a pair of electrode pads 371, 371 forsignal terminals exposed from the layer surface of the insulating layer38 and connected to the MR effect element 33, a pair of electrode pads373, 373 for signal terminals connected to the electromagnetic coilelement 34, and an electrode pad 375 for ground electrically connectedto the slider substrate 220. The end faces of the MR effect element 33,electromagnetic coil element 34, and near-field light generator 36 areexposed in the medium-facing surface S. Each of the elements will bedescribed below in detail.

FIG. 4 is a sectional view of the part near the magnetic head portion ofthe thermally assisted magnetic head 21. As shown in FIG. 4, the MReffect element 33 includes an MR laminate 332, and a lower shield layer330 and an upper shield layer 334 located at respective positions onboth sides of this MR laminate 332. The lower shield layer 330 and theupper shield layer 334 can be made, for example, of a magnetic materialof NiFe, CoFeNi, CoFe, FeN, FeZrN, or the like and in the thickness ofabout 0.5-3 μm by a pattern plating method including a frame platingmethod, or the like. The upper and lower shield layers 334 and 330prevent the MR laminate 332 from being affected by an external magneticfield serving as noise.

The MR laminate 332 includes a magneto-resistance effect film such as anin-plane conduction type (CIP (Current In Plane)) Giant MagnetoResistance (GMR) multilayer film, a perpendicular conduction type (CPP(Current Perpendicular to Plane)) GMR multilayer film, or a TunnelMagneto Resistance (TMR) multilayer film, and is sensitive to a signalmagnetic field from the magnetic disk with very high sensitivity.

For example, when the MR laminate 332 includes a TMR effect multilayerfilm, it has a structure in which the following layers are stacked inorder: an antiferromagnetic layer made of IrMn, PtMn, NiMn, RuRhMn, orthe like and in the thickness of about 5-15 μm; a magnetization fixedlayer comprised, for example, of CoFe or the like as a ferromagneticmaterial, or two layers of CoFe or the like with a nonmagnetic metallayer of Ru or the like in between, and having the magnetizationdirection fixed by the antiferromagnetic layer; a tunnel barrier layerof a nonmagnetic dielectric material made, for example, by oxidizing ametal film of Al, AlCu, or the like about 0.5-1 nm thick by oxygenintroduced into a vacuum chamber, or by natural oxidation; and amagnetization free layer comprised, for example, of two layered films ofCoFe or the like about 1 nm thick and NiFe or the like about 3-4 nmthick as a ferromagnetic material, and effecting tunnel exchangecoupling through the tunnel barrier layer with the magnetization fixedlayer.

An interelement shield layer 148 made of the same material as the lowershield layer 330 is formed between the MR effect element 33 and thewaveguide 35. The interelement shield layer 148 performs a function ofshielding the MR effect element 33 from a magnetic field generated bythe electromagnetic coil element 34 and preventing external noise duringreadout. A backing coil portion may also be further formed between theinterelement shield layer 148 and the waveguide 35. The backing coilportion generates a magnetic flux to cancel a magnetic flux loopgenerated by the electromagnetic coil element 34 and passing via theupper and lower electrode layers of the MR effect element 33, andthereby suppresses the Wide Area Track Erasure (WATE) phenomenon beingan unwanted writing or erasing operation on the magnetic disk.

The insulating layer 38 made of alumina or the like is formed betweenthe shield layers 330, 334 on the opposite side to the medium-facingsurface S of the MR laminate 332, on the opposite side to themedium-facing surface S of the shield layers 330, 334, 148, between thelower shield layer 330 and the slider substrate 220, and between theinterelement shield layer 148 and the waveguide 35.

When the MR laminate 332 includes a CIP-GMR multilayer film, upper andlower shield gap layers for insulation of alumina or the like areprovided between each of the upper and lower shield layers 334 and 330,and the MR laminate 332. Furthermore, an MR lead conductor layer forsupplying a sense current to the MR laminate 332 to extract reproductionoutput is formed though not shown. On the other hand, when the MRlaminate 332 includes a CPP-GMR multilayer film or a TMR multilayerfilm, the upper and lower shield layers 334 and 330 also function asupper and lower electrode layers, respectively. In this case, the upperand lower shield gap layers and MR lead conductor layer are unnecessaryand omitted.

A hard bias layer of a ferromagnetic material such as CoTa, CoCrPt, orCoPt, for applying a vertical bias magnetic field for stabilization ofmagnetic domains, is formed on both sides in the track width directionof the MR laminate 332, though not shown.

The electromagnetic coil element 34 is preferably one for perpendicularmagnetic recording and, as shown in FIG. 4, has a main magnetic polelayer 340, a gap layer 341 a, a coil insulating layer 341 b, a coillayer 342, and an auxiliary magnetic pole layer 344.

The main magnetic pole layer 340 is a magnetic guide for guiding amagnetic flux induced by the coil layer 342, up to the recording layerof the magnetic disk (medium) as a target of writing, while convergingthe magnetic flux. The end of the main magnetic pole layer 340 on themedium-facing surface S side preferably has a width in the track widthdirection (depth direction in FIG. 4) and a thickness in the stackdirection (horizontal direction in FIG. 4) smaller than those of theother portions. This results in permitting the main magnetic pole layerto generate a fine and strong writing magnetic field adapted for highrecording density. Specifically, for example, as shown in FIG. 5 whichis a view of the magnetic head portion from the medium-facing surface Sside, the tip of the main magnetic pole layer 340 on the medium-facingsurface S side is preferably tapered in a shape of an inverted trapezoidwhose length of the side on the leading side or slider substrate 220side is shorter than the length of the side on the trailing side.Namely, the end face of the main magnetic pole layer 340 on themedium-facing surface side is provided with a bevel angle θ, in order toavoid unwanted writing or the like on an adjacent track by influence ofa skew angle made by actuation with a rotary actuator. The magnitude ofthe bevel angle θ is, for example, approximately 15°. In practice, thewriting magnetic field is generated mainly near the longer side on thetrailing side and in the case of the magnetic dominant recording, thelength of this longer side determines the width of the writing track.

Here the main magnetic pole layer 340 is preferably made, for example,in the total thickness of about 0.01 to about 0.5 μm at the end portionon the medium-facing surface S side and in the total thickness of about0.5 to about 3.0 μm at the portions other than this end portion and, forexample, of an alloy of two or three out of Ni, Fe, and Co by frameplating, sputtering, or the like, or an alloy containing the foregoingelements as main ingredients and doped with a predetermined element. Thetrack width can be, for example, 100 nm.

As shown in FIG. 4, the end portion of the auxiliary magnetic pole layer344 on the medium-facing surface S side forms a trailing shield portionwider in a layer section than the other portion of the auxiliarymagnetic pole layer 344. The auxiliary magnetic pole layer 344 isopposed through the gap layer 341 a and coil insulating layer 341 b madeof an insulating material such as alumina, to the end of the mainmagnetic pole layer 340 on the medium-facing surface S side. When theauxiliary magnetic pole layer 344 of this configuration is provided, themagnetic field gradient becomes steeper between the auxiliary magneticpole layer 344 and the main magnetic pole layer 340 near themedium-facing surface S. This results in decreasing jitter of signaloutput and permitting decrease in the error rate during readout.

The auxiliary magnetic pole layer 344 is made, for example, in thethickness of about 0.5 to about 5 μm and, for example, of an alloy oftwo or three out of Ni, Fe, and Co by frame plating, sputtering, or thelike, or an alloy containing these as principal ingredients and dopedwith a predetermined element.

The gap layer 341 a separates the coil layer 342 from the main magneticpole layer 340 and is made, for example, in the thickness of about 0.01to about 0.5 μm and, for example, of Al₂O₃ or DLC or the like bysputtering, CVD, or the like.

The coil layer 342 is made, for example, in the thickness of about 0.5to about 3 μm and, for example, of Cu or the like by frame plating orthe like. The rear end of the main magnetic pole layer 340 is coupledwith the portion of the auxiliary magnetic pole layer 344 apart from themedium-facing surface S and the coil layer 342 is formed so as tosurround this coupling portion.

The coil insulating layer 341 b separates the coil layer 342 from theauxiliary magnetic pole layer 344 and is made, for example, in thethickness of about 0.1 to about 5 μm and of an electric insulatingmaterial such as thermally cured alumina or resist layer or the like.

The waveguide 35 is located between the MR effect element 33 and theelectromagnetic coil element 34, extends in parallel with theintegration surface 2202, extends from the medium-facing surface S ofthe magnetic head portion 32 to the surface 32 a opposite to themedium-facing surface of the magnetic head portion 32, and is of arectangular plate shape, as shown in FIG. 6. The waveguide 35 has twoside faces 351 a, 351 b opposed in the track width direction, and twoupper face 352 a and lower face 352 b parallel to the integrationsurface 2202, all of which are formed perpendicularly to themedium-facing surface S, and the waveguide 35 also has an exit face 353forming the medium-facing surface S, and an entrance face 354 oppositeto the exit face 353. The upper face 352 a, the lower face 352 b, andthe two side faces 351 a, 351 b of the waveguide 35 are in contact withthe insulating layer 38 having the refractive index smaller than that ofthe waveguide 35 and functioning as a cladding for the waveguide 35.

This waveguide 35 is able to guide light incident through the entranceface 354, to the exit face 353 as the end face on the medium-facingsurface S side, while reflecting the light on the two side faces 351 a,351 b, the upper face 352 a, and the lower face 352 b. The width W35 ofthe waveguide 35 in the track width direction in FIG. 6 can be, forexample, 1-200 μm, the thickness T35, for example, 2-10 μm, and theheight H35 10-300 μm.

The waveguide 35 is made, for example, by sputtering or the like, from adielectric material which has the refractive index n higher than that ofthe material making the insulating layer 38, everywhere. For example, ina case where the insulating layer 38 is made of SiO₂ (n=1.5), thewaveguide 35 may be made of Al₂O₃ (n=1.63). Furthermore, in a case wherethe insulating layer 38 is made of Al₂O₃ (n=1.63), the waveguide 35 maybe made of Ta₂O₅ (n=2.16), Nb₂O₅ (n=2.33), TiO (n=2.3-2.55), or TiO₂(n=2.3-2.55). When the waveguide 35 is made of one of such materials,the total reflection condition is met at the interface, in addition tothe good optical characteristics of the material itself, so as todecrease the propagation loss of laser light and increase the efficiencyof generation of near-field light.

The near-field light generator 36, as shown in FIGS. 2, 4, 5, and 6, isa platelike member disposed nearly in the center of the exit face 353 ofthe waveguide 35. As shown in FIGS. 4 and 6, the near-field lightgenerator 36 is buried in the exit face 353 of the waveguide 35 so thatthe end face thereof is exposed in the medium-facing surface S. As shownin FIG. 5, the near-field light generator 36 is of a triangular shapewhen viewed from the medium-facing surface S, and is made of anelectroconductive material. The base 36 d of the triangle is arranged inparallel with the integration surface 2202 of the slider substrate 220or in parallel with the track width direction, and the vertex 36 cfacing the base is arranged on the main magnetic pole layer 340 side ofthe electromagnetic coil element 34 with respect to the base 36 d;specifically, the vertex 36 c is arranged opposite to the leading edgeof the main magnetic pole layer 340. A preferred form of the near-fieldlight generator 36 is an isosceles triangle whose two base angles at thetwo ends of the base 36 d are equal to each other.

The near-field light generator 36 is preferably made of Au, Ag, Al, Cu,Pd, Pt, Rh, or Ir, or an alloy as a combination of two or more selectedfrom the foregoing elements.

In FIG. 5, the radius of curvature of the vertex 36 c is preferably5-100 nm. The height H36 of the triangle is preferably sufficientlysmaller than the wavelength of incident laser light and preferably20-400 nm. The width W36 of the base 36 d is preferably sufficientlysmaller than the wavelength of incident laser light and preferably20-400 nm. The thickness T36 of the near-field light generator 36 inFIG. 6 is preferably 10-100 nm.

When the near-field light generator 36 is disposed on the exit face 353of the waveguide 35, the electric field is concentrated near the vertex36 c of the near-field light generator 36 and the near-field light isgenerated from near the vertex 36 c toward the medium. This will bedetailed later.

In this slider 22, as shown in FIG. 2, the electrode pads 371, 371 areelectrically connected through bonding wires to the respective electrodepads 237, 237 of the flexure 201, and the electrode pads 373, 373 areconnected through bonding wires to the respective electrode pads 238,238 of the flexure 201; this configuration allows each of theelectromagnetic coil element and the MR effect element to be driven. Theelectrode pad 375 electrically connected through a via hole 375 a inFIG. 4 to the slider substrate 220 is connected through a bonding wireto the electrode pad 247 of the flexure 201, as shown in FIG. 2, wherebya potential of the slider substrate 220 can be controlled, for example,to the ground potential by the electrode pad 247.

(Light Source Unit)

The components of the light source unit 23 in the thermally assistedmagnetic head 21 will be described below.

As shown in FIGS. 2 to 4, the light source unit 23 mainly has a lightsource support substrate 230 and a laser diode (light source) 40 whosecontour is platelike.

The light source support substrate 230 is a substrate of AlTiC(Al₂O₃−TiC) or the like and has the bond surface 2300 bonded to the backsurface 2201 of the slider substrate 220. As shown in FIG. 4, a heatinsulation layer 230 a of alumina or the like is formed on the bondsurface 2300. An insulating layer 41 of an insulating material such asalumina is disposed on an element forming surface 2302 being one sidesurface when the bond surface 2300 is regarded as a bottom surface. Theelectrode pads 47, 48 are formed on this insulating layer 41, and thelaser diode 40 is fixed on the electrode pad 47.

More specifically, as shown in FIGS. 2 and 3, the electrode pads 47, 48are formed for driving of laser, on a surface 411 intersecting with thefront surface of the insulating layer 41 and with the medium-facingsurface S and, in other words, they are formed on the surface 411parallel to the integration surface 2202 of the slider substrate 220.The electrode pad 47, as shown in FIG. 4, is electrically connectedthrough a via hole 47 a provided in the insulating layer 41, to thelight source support substrate 230. The electrode pad 47 also functionsas a heat sink for leading heat during driving of the laser diode 40through the via hole 47 a to the light source support substrate 230side.

The electrode pad 47, as shown in FIG. 2, is formed so as to extend inthe track width direction in the central region of the surface 411 ofthe insulating layer 41. On the other hand, the electrode pad 48 isformed at a position separate in the track width direction from theelectrode pad 47. Each of the electrode pads 47, 48 further extendstoward the flexure 201 side, for connection with the flexure 201 bysolder reflow.

The electrode pads 47, 48 are electrically connected to the electrodepads 247, 248 of the flexure 201, respectively, by reflow soldering,whereby the light source can be driven. Since the electrode pad 47 iselectrically connected to the light source support substrate 230 asdescribed above, the potential of the light source support substrate 230can be controlled, for example, to the ground potential by the electrodepad 247.

The electrode pads 47, 48 can be comprised, for example, of layers ofAu, Cu, or the like made in the thickness of about 1-3 μm and by vacuumevaporation, sputtering, or the like, which are formed, for example,through a ground layer of Ta, Ti, or the like about 10 nm thick.

The laser diode 40 is electrically connected onto the electrode pad 47by a solder layer 42 (cf. FIG. 4) of an electrically conductive soldermaterial such as Au—Sn. At this time, the laser diode 40 is locatedrelative to the electrode pad 47 so as to cover only a part of theelectrode pad 47.

As shown in FIG. 7, the laser diode 40 may have the same structure asthe one normally used for an optical disk storage, and, for example, hasa structure in which the following layers are stacked in order: ann-electrode 40 a; an n-GaAs substrate 40 b; an n-InGaAlP cladding layer40 c; a first InGaAlP guide layer 40 d; an active layer 40 e consistingof multiple quantum wells (InGaP/InGaAlP) or the like; a second InGaAlPguide layer 40 f; a p-InGaAlP cladding layer 40 g; an *n-GaAs currentblocking layer 40 h; a p-GaAs contact layer 40 i; a p-electrode 40 j.Reflecting films 50 and 51 of SiO₂, Al₂O₃, or the like for excitingoscillation by total reflection are deposited before and after cleavagefaces of the multilayer structure, and an aperture is provided at theposition of the active layer 40 e in one reflecting film 50, at anoutput end 400 for emission of laser light. The laser diode 40 of thisconfiguration emits laser light from the output end 400 when a voltageis applied thereto in the film thickness direction.

The wavelength λ_(L) of the emitted laser light is, for example,approximately 600-650 nm. It should be, however, noted that there is anappropriate excitation wavelength according to the metal material of thenear-field light generator 36 (FIG. 2). For example, in a case where Auis used for the near-field light generator 36, the wavelength λ_(L) ofthe laser light is preferably near 600 nm.

The size of the laser diode 40 is, for example, the width (W40) of200-350 μm, the length (depth L40) of 250-600 μm, and the thickness(T40) of about 60-200 μm, as described above. The width W40 of the laserdiode 40 can be decreased, for example, to about 100 μm, while theminimum thereof is a spacing between opposed ends of the currentblocking layer 40 h. However, the length of the laser diode 40 is thequantity associated with the electric current density and thus cannot bedecreased so much. In either case, the laser diode 40 is preferablydimensioned in a sufficient size, in consideration of handling duringmounting.

A power supply in the hard disk drive can be used for driving of thislaser diode 40. In practice, the hard disk drive is usually equipped,for example, with the power supply of about 2 V, which is a sufficientvoltage for the lasing operation. The power consumption of the laserdiode 40 is also, for example, approximately several ten mW, which thepower supply in the hard disk drive can fully provide.

In FIG. 4, the n-electrode 40 a of the laser diode 40 is fixed to theelectrode pad 47 by the solder layer 42 such as AuSn. The laser diode 40is fixed to the light source support substrate 230 so that the outputend 400 of the laser diode 40 is directed downward in FIG. 4, i.e., sothat the output end 400 becomes parallel to the bond surface 2300;whereby the output end 400 can face the entrance face 354 of thewaveguide 35 of the slider 22. In practical fixing of the laser diode40, for example, an evaporated film of AuSn alloy is deposited in thethickness of about 0.7-1 μm on the surface of the electrode pad 47, thelaser diode 40 is mounted thereon, and thereafter it is heated to befixed, to about 200-300° C. by a hot plate or the like under a hot airblower. As shown in FIGS. 2 and 7, the electrode pad 48 is electricallyconnected through a bonding wire to the p-electrode 40 j of the laserdiode 40. The electrode connected to the electrode pad 47 may also bethe p-electrode 40 j, instead of the n-electrode 40 a, and in this case,the n-electrode 40 a is connected through a bonding wire to theelectrode pad 48.

In the case of soldering with the aforementioned AuSn alloy, the lightsource unit is heated, for example, to the high temperature of about300° C., but according to the present invention, this light source unit23 is produced separately from the slider 22; therefore, the magnetichead portion in the slider is prevented from being adversely affected bythis high temperature.

The back surface 2201 of the aforementioned slider 22 and the bondsurface 2300 of the light source unit 23 are bonded, for example, withan adhesive layer 44 such as a UV cure type adhesive, as shown in FIG.4, and the output end 400 of the laser diode 40 is arranged opposite tothe entrance face 354 of the waveguide 35.

The configurations of the laser diode 40 and the electrode pads do notalways have to be limited to those in the above-described embodiment, ofcourse, and, for example, the laser diode 40 may be one of anotherconfiguration using other semiconductor materials, such as GaAlAs typematerials. Furthermore, it is also possible to use any other brazingmaterial, for the soldering between the laser diode 40 and theelectrode. Yet furthermore, the laser diode 40 may be formed directly onthe unit substrate by epitaxially growing the semiconductor materials.

(Production Method)

Subsequently, a method of producing the thermally assisted magnetic headdescribed above will be described below briefly.

First, the slider 22 is produced. Specifically, the slider substrate 220is prepared, the MR effect element 33 and interelement shield layer 148are formed by well-known methods, and the insulating layer 38 of aluminaor the like is further formed as a ground layer.

Subsequently, the waveguide 35 and near-field light generator 36 areformed. This process will be described in detail with reference to FIGS.8 and 9. FIGS. 8 and 9 are perspective views to illustrate an embodimentof the method of forming the waveguide 35 and the near-field lightgenerator 36.

In the first step, as shown in (A) of FIG. 8, a dielectric film 35 a ofTa₂O₅ or the like with the refractive index higher than that of theinsulating layer 38 a, which will be a part of the waveguide 35, isfirst deposited on the insulating layer 38 a of Al₂O₃ or the like, ametal layer 36 a of Au or the like is then deposited thereon, and aresist pattern 1002 depressed for liftoff in the bottom part is formedthereon.

In the next step, as shown in (B) of FIG. 8, unnecessary portions of themetal layer 36 a are removed except immediately below the resist pattern1002 by ion milling or the like, thereby forming a pattern of the metallayer 36 a of a trapezoid shape wider in the bottom as deposited on thedielectric film 35 a.

In the subsequent step, as shown in (C) of FIG. 8, the resist pattern1002 is removed, and a part of each slope is removed from the two slopesides of the metal layer 36 a of the trapezoid shape by ion milling orthe like, to form the metal layer 36 a in a triangular sectional shape.

Subsequently, as shown in (D) of FIG. 8, a dielectric film 35 b of thesame material as the dielectric film 35 a is deposited on the dielectricfilm 35 a so as to cover the metal layer 36 a, a resist pattern 1003 forformation of the end face of the metal layer 36 a is laid on the sidewhere the medium-facing surface will be formed, the metal layer 36 a andthe dielectric film 35 b are removed by ion milling or the like, fromthe side opposite to the side where the medium-facing surface will beformed, as shown in (A) of FIG. 9, and thereafter a dielectric film 35 cof the same material as the dielectric film 35 b is deposited on theremoved portion.

Furthermore, as shown in (B) of FIG. 9, a dielectric film 35 d of thesame material as the dielectric film 35 b is further deposited on thedielectric films 35 b, 35 c, and the dielectric films 35 a, 35 b, 35 c,35 d are patterned so as to achieve a predetermined width, therebyalmost completing the waveguide 35.

Thereafter, as shown in (C) of FIG. 9, an insulating layer 38 b of thesame material as the insulating layer 38 a is further formed so as tocover the waveguide 35, thereby completing the insulating layer 38 as acladding layer. Then lapping is performed by a predetermined distancefrom the side where the metal layer 36 a is exposed, as described later,to form the near-field light generator 36 of the predetermined thicknessand the medium-facing surface S.

The above steps can form the waveguide 35 with the near-field lightgenerator 36 therein.

After that, the electromagnetic coil element 34 is formed by thewell-known method as shown in FIG. 4, and then the insulating layer 38of alumina or the like is formed. Furthermore, the electrode pads 371and others for connection are formed and thereafter lapping of the airbearing surface and the back surface thereof is performed to completethe slider 22. After this step, tests of the electromagnetic coilelement 34 and the MR effect element 33 of slider 22 are conducted foreach slider, to select a nondefective product.

Subsequently, the light source unit 23 is produced. In the first step,as shown in FIG. 4, the light source support substrate 230 of AlTiC orthe like is prepared, the heat insulation layer 230 a, insulating layer41, and electrode pads 47, 48 are formed on the surfaces of thesubstrate by well-known methods, the laser diode 40 is fixed on theelectrode pad 47 by an electrically conductive solder material such asAuSn, and thereafter the substrate is shaped into a predetermined sizeby separation by cutting or the like. This completes the light sourceunit 23. The light source unit obtained in this manner is also subjectedto characteristic evaluation of the laser diode, particularly,observation of a profile of drive current by a high-temperaturecontinuous conduction test, to select one considered to have asufficiently long life.

After that, as shown in (A) of FIG. 10, a UV cure type adhesive 44 a isapplied onto either or both of the bond surface 2300 of the light sourceunit 23 as a nondefective unit and the back surface 2201 of the slider22 as a nondefective unit. The UV cure type adhesive can be a UV curetype epoxy resin, a UV cure type acrylic resin, or the like.

Then, as shown in (B) of FIG. 10, the bond surface 2300 of the lightsource unit 23 and the back surface 2201 of the slider 22 are laid oneach other, and then the laser diode 40 is activated with application ofa voltage between the electrode pads 47, 48, and a photodetector DT isopposed to the exit face 353 of the waveguide 35. The light source unit23 and the slider 22 are relatively moved in directions of arrows in (B)of FIG. 10 to find out a position where the output from thephotodetector DT becomes maximum. At that position, UV light is appliedfrom the outside onto the UV cure type adhesive to cure the UV cure typeadhesive 44 a, which can bond the light source unit 23 and the slider 22to each other in a state in which the optical axis of the laser diode isaligned with the optical axis of the waveguide 35.

(Action)

Subsequently, the action of the thermally assisted magnetic head 21according to the present embodiment will be described below.

During a writing or reading operation, the thermally assisted magnetichead 21 hydromechanically floats up by a predetermined levitation amountabove the surface of the rotating magnetic disk (medium) 10. On thisoccasion, the ends on the medium-facing surface S side of the MR effectelement 33 and the electromagnetic coil element 34 are opposed through asmall spacing to the magnetic disk 10, thereby implementing readout bysensing of a data signal magnetic field and writing by application of adata signal magnetic field.

On the occasion of writing of a data signal, the laser light havingpropagated from the light source unit 23 through the waveguide 35reaches the near-field light generator 36, whereupon the near-fieldlight generator 36 generates the near-field light. This near-field lightenables execution of thermally assisted magnetic recording as describedbelow.

Here the near-field light generally has the maximum intensity at theborder of the near-field light generator 36 when viewed from themedium-facing surface S, though it depends upon the wavelength of theincident laser light and the shape of the waveguide 35. Particularly,the present embodiment is arranged as follows in FIG. 4: the stackdirection of the laser diode 40 is the horizontal direction in FIG. 4;the electric field vector of the light arriving at the near-field lightgenerator 36 is the horizontal direction in FIG. 4, i.e., the verticaldirection in FIG. 5. Therefore, radiation of the strongest near-fieldlight occurs near the vertex 36 c. Namely, the part facing the vicinityof this vertex 36 c becomes a major heat-acting portion in the thermalassist action to heat a portion of the recording layer of the magneticdisk with light.

Since the electric field intensity of this near-field light isimmeasurably stronger than that of the incident light, this very strongnear-field light rapidly heats the opposed local part of the surface ofthe magnetic disk. This reduces the coercive force of this local part toa level allowing writing with the writing magnetic field, wherebywriting with the electromagnetic coil element 34 becomes feasible evenwith use of the magnetic disk of a high coercive force for high-densityrecording. The near-field light penetrates to the depth of about 10-30nm from the medium-facing surface S toward the surface of the magneticdisk. Therefore, under the present circumstances where the levitationamount is 10 nm or less, the near-field light can reach the recordinglayer part sufficiently. The width in the track width direction and thewidth in the medium moving direction of the near-field light generatedin this manner are approximately equal to the aforementioned reach depthof the near-field light, and the electric field intensity of thisnear-field light exponentially decreases with increase in the distance;therefore, the near-field light can heat the recording layer part of themagnetic disk in an extremely localized area.

By adopting the thermally assisted magnetic recording as describedabove, it also becomes feasible to achieve, for example, the recordingdensity of 1 Tbits/in² order, by performing writing on the magnetic diskof a high coercive force by means of the thin film magnetic head forperpendicular magnetic recording to record recording bits in anextremely fine size.

The present embodiment uses the light source unit 23, so that the laserlight propagating in the direction parallel to the layer surface of thewaveguide 35 can be made incident to the entrance face (end face) 354 ofthe waveguide 35 of the slider 22. Namely, the laser light ofappropriate size and direction can be surely supplied in the thermallyassisted magnetic head 21 having the configuration in which theintegration surface 2202 and the medium-facing surface S areperpendicular to each other. As a result, it is feasible to implementthe thermally assisted magnetic recording with high heating efficiencyof the recording layer of the magnetic disk.

Since in the present embodiment the magnetic head portion 32 is fixed tothe slider substrate 220 and the laser diode 40 as the light source isseparately fixed to the light source support substrate 230, thethermally assisted magnetic head 21 as a nondefective product can beproduced with a good yield by individually testing each of theelectromagnetic coil element 34 fixed to the slider substrate 220 andthe laser diode 40 fixed to the light source support substrate 230, andthereafter fixing the slider 22 as a nondefective unit and the lightsource unit 23 as a nondefective unit to each other.

Since the magnetic head portion 32 is disposed on the side surface ofthe slider substrate 220, the electromagnetic coil element 34, the MReffect element 33, and others of the magnetic head portion 32 can bereadily formed by the production methods of the conventional thin filmmagnetic heads.

Furthermore, since the laser diode 40 is located at the position apartfrom the medium-facing surface S and near the slider 22, it is feasibleto suppress the adverse effect of the heat generated from the laserdiode 40, on the electromagnetic coil element 34, the MR effect element33, etc., and the possibilities of contact or the like between the laserdiode 40 and the magnetic disk 10, to reduce the propagation loss oflight because of the dispensability of an optical fiber, a lens, amirror, etc., and to simplify the structure of the entire magneticrecording apparatus.

Since in the present embodiment the heat insulation layer 230 a isformed on the back surface of the light source support substrate 230,the heat generated from the laser diode 40 is less likely to betransferred to the slider 22.

In the above embodiment the slider substrate 220 and the light sourcesupport substrate 230 were the substrates of the same material of AlTiC,but it is also possible to use substrates of different materials. Inthis case, where the thermal conductivity of the slider substrate 220 isλs and the thermal conductivity of the light source support substrate230 is λl, they are preferably selected to satisfy λs≦λl. Thisfacilitates the transfer of the heat generated by the laser diode 40,through the light source support substrate 230 to the outside whileminimizing the transfer of the heat to the slider substrate 220.

The sizes of the slider 22 and the light source unit 23 are arbitrary,but the slider 22 may be, for example, a so-called femtoslider havingthe width of 700 μm in the track width direction×length (depth) of 850μm×thickness of 230 μm. In this case, the light source unit 23 can havethe width and length approximately equal to them. In fact, the typicalsize of the ordinary laser diode is approximately the width of 250μm×length (depth) of 350 μm×thickness of 65 μm, and the laser diode 40of this size can be adequately mounted, for example, on the side surfaceof the light source support substrate 230 of this size. It is alsopossible to make a groove in the bottom surface of the light sourcesupport substrate 230 and locate the laser diode 40 in this groove.

The spot of the far field pattern of the laser light reaching theentrance face 354 of the waveguide 35 can be made in the size in thetrack width direction, for example, of about 0.5-1.0 μm and the sizeperpendicular to the foregoing size, for example, of about 1-5 μm. Incorrespondence thereto, the thickness T35 of the waveguide 35 receivingthis laser light is preferably, for example, about 2-10 μm so as to belarger than the spot and the width (W35) in the track width direction ofthe waveguide 35 is preferably, for example, about 1-200 μm.

The electromagnetic coil element 34 may be one for longitudinal magneticrecording. In this case, a lower magnetic pole layer and an uppermagnetic pole layer are provided instead of the main magnetic pole layer340 and the auxiliary magnetic pole layer 344, and a writing gap layeris interposed between the ends on the medium-facing surface S side ofthe lower magnetic pole layer and the upper magnetic pole layer. Writingis implemented by a leakage magnetic field from the position of thiswriting gap layer.

The shape of the near-field light generator is not limited to the onedescribed above, either, and it can also be, for example, a trapezoidshape resulting from truncation of the vertex 36 c, instead of thetriangular shape. It is also possible to adopt a so-called “bow tietype” structure in which a pair of sheets of a triangular shape or atrapezoidal shape are opposed to each other with their vertices orshorter sides being spaced by a predetermined distance. In this “bow tietype” structure, a very strong electric field is concentrated in thecentral region thereof.

The coil layer 342 is one layer in FIG. 4 and others, but it may be twoor more layers, or a helical coil.

In another embodiment, the near-field light generator 36 may be a smallaperture smaller than the wavelength of light, disposed on themedium-facing surface S side of the waveguide 35.

The heat insulation layer 230 a may be formed on the back surface 2201of the slider substrate 220, and the present invention can also becarried out without the heat insulation layer.

The bonding between the light source unit 23 and the slider 22 can alsobe implemented with any adhesive other than the UV cure type adhesive,e.g., with a solder layer of AuSn or the like which was used in thebonding between the laser diode 40 and the electrode pad 47.

It should be noted that the above-described embodiments all weredescribed as illustrative of the present invention but not restrictiveof the invention, and that the present invention can also be carried outin a variety of other modification and change forms. Therefore, thescope of the present invention should be defined by the scope of claimsand scope of equivalents thereof only.

1. A thermally assisted magnetic head comprising: a slider having amedium-facing surface; and a light source unit having a light sourcesupport substrate and a light source disposed on the light sourcesupport substrate; wherein the slider has a slider substrate and amagnetic head portion disposed on a side of the medium-facing surface inthe slider substrate; wherein the magnetic head portion comprises amagnetic recording element for generating a magnetic field, and awaveguide for receiving light through an end face thereof opposite tothe medium-facing surface, and guiding the light to the medium-facingsurface; wherein the light source support substrate is fixed to asurface opposite to the medium-facing surface in the slider substrate sothat light emitted from the light source can enter the end face of thewaveguide.
 2. The thermally assisted magnetic head according to claim 1,wherein the light source is disposed on a side surface of the lightsource support substrate.
 3. The thermally assisted magnetic headaccording to claim 1, wherein the light source is a laser diode.
 4. Thethermally assisted magnetic head according to claim 1, wherein λs≦λl issatisfied, where λs is a thermal conductivity of the slider substrateand λl is a thermal conductivity of the light source support substrate.5. The thermally assisted magnetic head according to claim 1, wherein aheat insulation layer is disposed on an opposed surface to the lightsource support substrate in the slider substrate or on an opposedsurface to the slider substrate in the light source support substrate.6. The thermally assisted magnetic head according to claim 1, whereinthe slider substrate and the light source support substrate are fixed toeach other with a UV cure type adhesive.
 7. The thermally assistedmagnetic head according to claim 1, wherein in the magnetic head portionthe waveguide is located between the magnetic recording element and theslider substrate.
 8. The thermally assisted magnetic head according toclaim 7, wherein the magnetic head portion further comprises a magneticdetecting element, and wherein the waveguide is located between themagnetic recording element and the magnetic detecting element.
 9. Thethermally assisted magnetic head according to claim 1, furthercomprising a near-field light generator for generating near-field light,on an end face on the medium-facing surface side of the waveguide. 10.The thermally assisted magnetic head according to claim 9, wherein thenear-field light generator is an electroconductive sheet of a triangularshape when viewed from the medium-facing surface.
 11. A head gimbalassembly comprising the thermally assisted magnetic head as defined inclaim 1, and a suspension supporting the thermally assisted magnetichead.
 12. A hard disk drive comprising the head gimbal assembly asdefined in claim 11, and a magnetic recording medium.